eucleveladhesives
Học việc

Ngày sinh

November 18, 1993 (32)

Về eucleveladhesives

Biography:

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. https://www.epoxyadhesiveglue.com/product/epoxy-underfill-chip-level-adhesives/

Location:

Huizhou City, Guangdong，China